Adhesion apparatus

ABSTRACT

A method of adhesion inhibiting generation of bubbles is provided. Heating, evacuation and centrifugal degassing are performed on an adhesive  37  disposed in an adhesive container  30  to semi-harden the adhesive  37 , then a semi-hardened adhesive is discharged as disposed in the adhesive container  30  to mount a chip. Removal of bubbles is efficiently performed since semi-hardening and degassing are simultaneously performed. Further, no defective product is produced even if a working process is stopped since no process for semi-hardening a discharged adhesive exists.

BACKGROUND OF INVENTION

1. Field of the Invention

The present invention relates to a technology for mounting a chip on aresin film, more particularly to a technology for fixing a chip to aresin film by discharging a certain amount of adhesive.

2. Background Art

In recent years, a technology that involves a bare chip made of asemiconductor mounted on a wiring board has been developed, and thetechnology has been frequently used to manufacture miniature electronicdevices such as mobile phones since a packaging area can be made smallerthan that of a case where a chip molded into a resin is mounted.

FIGS. 7 (a) to (e) describe a conventional process for mounting a barechip. First, referring to FIG. 7 (a), numeral 113 shows a base filmcomposed of a flexible resin and a wiring film 122 composed of apatterned copper foil formed on the surface of the base film 113.

To the surface of the base film 113 on which the wiring film 122 isformed, an anisotropic conductive film 115 is affixed as shown in FIG. 7(b). The base film 113 is placed on a preheating table 151 whileorienting the back side thereof downward as shown in FIG. 7 (c).

The anisotropic conductive film 115 is composed of a thermosetting resinas a main agent and conductive particles are dispersed in the mainagent.

The preheating table 151 is preheated at a temperature higher than thecuring temperature of the main agent contained in the anisotropicconductive film 115. Thus, the anisotropic conductive film 115 is heatedby heat transmitted through the base film 113.

The main agent of the anisotropic conductive film 115 is semi-hardenedby placing both the base film 113 and the anisotropic conductive film115 on the surface of the base film 113 on the preheating table 151 fora predetermined time.

Next, as shown in FIG. 7 (d), the base film 113 and the semi-hardenedanisotropic conductive film 115 are moved from the preheating table 151to a working table 152; a semiconductor chip 111 is retained by apressing jig 129; the semiconductor chip 111 is moved to a positionabove the anisotropic conductive film 115; a bump 121 of thesemiconductor chip 111 and a connecting part of a wiring film 122 are sopositioned as to face each other; and then, as shown in FIG. 7(e) whenthe semiconductor chip 111 is pressed against the anisotropic conductivefilm 115 by the pressing jig 129, the bump 121 digs into the anisotropicconductive film 115; thereby the bump 121 is connected electrically tothe wiring film 122 through conductive particles dispersed in theanisotropic conductive film 115.

Since the pressing jig 129 and the working table 152 are heated at atemperature higher than that of the preheating table 151, by keeping thejig 129 to be pressed against the back side of the semiconductor chip111 for a predetermined time, the main agent in the anisotropicconductive film 115 hardens and, thus, the semiconductor chip 111 isfixed to the base film 113.

In the case where the anisotropic conductive film 115 is hardened asabove, the anisotropic conductive film 115 is first heated on thepreheating table 151, the film is moved to the surface of the workingtable 152 after the film is semi-hardened, and then mounting and heatingof the semiconductor chip 111 is performed; thereby heating time on theworking table can be shortened by the extent corresponding to theprevious semi-hardening.

However, if the semiconductor chip 111 is mounted on the anisotropicconductive film 115 on the working table 152 and the progress of theprocess is suspended, under the process of preheating before themounting since the anisotropic conductive film 115 is also kept on thepreheating table 151 for a long time, both of the anisotropic conductivefilms 115 become defective.

An alternative processing technique involves using a liquid adhesivematerial applied onto the base film 113 in place of the anisotropicconductive film 115. However, this processing has the problems that thematerial is likely to immix bubbles as compared with the anisotropicconductive film 115. As a result, a defect in aging caused by voidsfrequently occurs.

SUMMARY OF INVENTION

In one aspect, the present invention provides a method for adhesionwherein bubbles are not immixed and a defect does not frequently occur.

In one embodiment, the present invention relates to a method foradhesion comprising semi-hardening an adhesive capable of being hardenedby proceeding with a reaction through heating; discharging a desiredamount of the semi-hardened adhesive from a pore to dispose on an objectto be discharged; and mounting an object to be affixed to the object tobe discharged by contacting the object to be affixed to the adhesivedisposed on the object to be discharged, pressing the object to beaffixed against the object to be discharged, and then heating theadhesive existing between the object to be discharged and the object tobe affixed to harden the adhesive.

Thus, in one embodiment, the present invention comprises a method foradhesion, wherein the object to be affixed is heated in the mountingstep.

In one embodiment, the present invention comprises a method foradhesion, wherein, before performing the semi-hardening, the adhesive isdisposed in an adhesive container, and the semi-hardening step and thedischarging step are performed while placing the adhesive in the sameadhesive container.

In one embodiment, the present invention comprises a method foradhesion, wherein the adhesive container is heated to semi-harden theadhesive in the semi-hardening step.

In one embodiment, the present invention comprises a method foradhesion, wherein the adhesive container is heated in the semi-hardeningstep while applying a centrifugal force to the adhesive container.

In one embodiment, the present invention comprises a method foradhesion, wherein the adhesive is heated in the semi-hardening stepwhile placing the adhesive container in a vacuum atmosphere tovacuum-degas the adhesive.

In one embodiment, the present invention comprises a method foradhesion, wherein the adhesive is hardened at a reaction rate rangingfrom 2% or more to 20% or less in the semi-hardening step.

In one embodiment, the present invention comprises a method foradhesion, wherein a flexible resin film is used as the object to bedischarged and a semiconductor chip is used as the object to be affixed.

In one embodiment, the present invention comprises a method foradhesion, wherein a connecting part composed of a wiring film on theresin film and a connecting part provided on the chip are brought intocontact with each other, and the chip is fixed to the resin film in astate of electrical connection thereof.

In another aspect, the present invention relates to an adhesionapparatus that comprises an adhesive container connected to a pore andan adhesive disposed in the adhesive container and that is constitutedso as to discharge a desired amount of the adhesive through the pore,wherein the adhesive is disposed in the adhesive container, and acentrifugal force has been applied to the adhesive in a state of beingplaced in vacuum atmosphere with heating to be vacuum-degassed.

In one embodiment, the present invention comprises an adhesionapparatus, wherein the adhesive is semi-hardened at a reaction rateranging from 2% or more to 20% or less.

In one embodiment, the present invention uses an adhesive whose reactionproceeds by heating. The adhesive may contain either a thermosettingresin as a main component or a mixed resin of a thermosetting resin anda thermoplastic resin as a main component. Generally, it contains anadditive such as a coupling agent or a curing agent, or a filler.

In embodiments of the invention, an adhesive is semi-hardened in anadhesive container and placed in the adhesive container as it stands canbe used for a discharging process. In this case, it is no need to movethe adhesive to another container, thereby saving labor.

When the adhesive is heated to progress semi-hardening, bubbles aregenerated in the adhesive. In embodiments of the invention, however, acentrifugal force is applied to the adhesive. Accordingly, bubbles inthe adhesive quickly move to the surface of the adhesive and disappear.

Further, since the adhesive may be placed in a vacuum atmosphere duringsemi-hardening, bubbles are likely to be generated by an extent that theatmospheric pressure is not existent. When the adhesive is returnedunder the atmospheric pressure after bubbles have been removed in thestate, no bubbles are generated under the atmospheric pressure. Inaddition, the adhesive is heated during semi-hardening and is degassedin the state.

An object for adhesion, having been semi-hardened and being placed inthe discharging process, is kept at a lower temperature than that in thesemi-hardening process. In addition, since the temperature of theadhesive discharged on the object to be discharged is lower than that ofthe semi-hardening process, bubbles are never generated in the adhesivethat have been degassed in the semi-hardening process.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1 (a) to (c) show an adhesive container, a plug thereof, and amouthpiece member thereof, respectively;

FIG. 2 (a) shows a plugged adhesive container, and FIG. 2 (b) is a viewto explain the adhesive inside the container;

FIG. 3 (a) shows an adhesive container with the mouthpiece membermounted, and FIG. 3 (b) is a view to explain the adhesive inside thecontainer,

FIGS. 4 (a), (b) are views to explain the processes of heating,evacuation and centrifugal degassing;

FIGS. 5 (a), (b) are views to explain the discharging process of asemi-hardened adhesive;

FIGS. 6 (a) to (c) are views to explain the process for mounting chips;and

FIGS. 7 (a) to (e) are views to explain a method for adhesion in aconventional technology.

DETAILED DESCRIPTION

First, the degassing process by a method according to one embodiment ofthe invention is described hereunder.

Numeral 30 in FIG. 1 (a) shows an adhesive container.

The adhesive container 30 has a cylindrical container body 31 with abottom and a pipe-like protrusion 41. A hole 34 is formed at a bottompart 32 of the container body 31 and an end of the protrusion 41 isvertically connected to the outer side of the bottom part 32 in thestate that an inside 44 of the protrusion 41 is communicated with thehole 34.

Since the protrusion 41 is cylindrical, an aperture 43, which is locatedat the other end of the protrusion 41, is oriented opposite to theaperture 33 of the container body 31.

Numeral 50 in FIG. 1 (b) is a plug comprising a cylindrical plug body 51with a bottom.

Preferably, screw threads are provided on the inner periphery of theplug body 51 and the outer periphery of the protrusion 41, and it issuch constituted that when the plug body 51 is screwed into theprotrusion 41 while orienting the aperture 53 of the plug body 51 towardthe aperture 43 of the protrusion 41, the plug 50 is mounted on theadhesive container 30.

In the state that the plug 50 is mounted, as shown in FIG. 2 (b), thebottom part 52 of the plug body 51 in FIG. 1(b) plugs the aperture 43 inFIG. 1(a) of the protrusion 41.

In this state, when a liquid adhesive material is poured from theaperture 33 of the adhesive container 30 while orienting the aperture 33upward and orienting the plug 50 perpendicularly downward, the adhesivematerial is stored in the lower part of the container body 31. Numeral37 in FIG. 2(b) shows an adhesive material in the container body 41 andin the state, the adhesive material 37 is also filled in the protrusion41. The protrusion 41 and the container body 31 are fluid-tightlyconnected, and since the aperture 43 in FIG. 1(a) of the protrusion 41is plugged by the plug 50, the adhesive 37 does not leak outside.

Next, a process for degassing the adhesive material 37 in the adhesivecontainer 30 is described. Numeral 80 in FIG. 4 (a) shows centrifugaldegassing apparatus. The centrifugal degassing apparatus 80 is providedwith a vacuum chamber 81, a motor 84, a rotation axis 83, an arm 82 anda vacuum pumping system 85.

Symbols 87 a, 87 b in FIG. 4 (a) show a plurality of objects to besubjected to a degas operation (objects to be degassed, hereinafter)respectively. Objects to be degassed, 87 a and 87 b comprise theadhesive container 30, the adhesive 37 filled in the adhesive container30 and the plug 50 to prevent the leakage of the adhesive 37respectively. In addition, the aperture 33 of the adhesive container 30of the objects to be degassed, 87 a and 87 b may be covered with a lidmember to prevent the intrusion of dust.

In order to dispose the objects to be degassed, 87 a and 87 b in thevacuum chamber 81, a lid or door of the vacuum chamber 81 is firstopened and the objects to be degassed, 87 a and 87 b are hung at the arm82. As for the objects to be degassed, 87 a and 87 b hung at the arm 82,the plug 50 orients perpendicularly downward and the aperture 33 of thecontainer body 31 orients upward.

When the interior of the vacuum chamber 81 is evacuated by the vacuumpumping system 85 after closing the vacuum chamber 81 to prevent theintrusion of the atmosphere, the internal pressure of the vacuum chamber81 is lowered less than the atmospheric pressure. Namely, the adhesive37 is placed in a vacuum atmosphere and, therefore, gasses dissolved inthe adhesive 37 separate out as bubbles, and micro bubbles inflate.

The objects to be degassed, 87 a and 87 b are so constituted as to befreely swung in a plane running perpendicular at the rotation center ofthe arm 82, and when a motor 84 is started to allow a rotation axis 83to rotate around the perpendicular rotation axis while performingevacuation, the arm 82 is rotated in a horizontal plane and acentrifugal force is applied to the objects to be degassed, 87 a and 87b.

When a centrifugal force is applied to the objects to be degassed, 87 aand 87 b, the objects to be degassed, 87 a and 87 b are on the levelwith the arm 82 by the centriftigal force and are rotated with the plug50 oriented toward the outer direction of a rotation and the aperture 33of the container body 31 oriented toward the central direction of therotation.

Thus, a centrifugal force bigger than the gravitational force is appliedto the adhesive 37 and, as a result, the adhesive 37 is strongly pressedagainst the bottom 32 of the container body 31 and the plug 50; on thecontrary, bubbles in the adhesive 37 are forcibly pushed to the centraldirection of the rotation. And when the bubbles reach the surface of theadhesive 37, gasses constituting the bubbles are released in a vacuumatmosphere and are discharged to the outside of the vacuum atmosphere bythe vacuum pumping system 85.

In addition, in the centrifugal degassing apparatus 80, a heater 88 isdisposed in the vicinity of objects to be degassed, 87 a and 87 b underrotation.

It is such constituted that, by preheating the heater 88 when objects tobe degassed, 87 a and 87 b are rotated, infrared rays are irradiated toobjects to be degassed, 87 a and 87 b under rotation.

Accordingly, the adhesive container 30 constituting the objects to bedegassed, 87 a and 87 b under rotation is heated, therefore the adhesive37 in the adhesive container 30 is designed to be heated while acentrifugal force generated by the rotation is applied thereto.

Accordingly, since the hardening reaction of the adhesive 37 isproceeded by the heating, gasses dissolved in the adhesive 37 are likelyto be generated as bubbles and, further, the generated bubbles aredegassed by the centrifugal force and the evacuation.

However, if the hardening reaction of the adhesive 37 during evacuation,heating and centrifugal degassing excessively proceeds, the adhesive 37can not be discharged in a subsequent process. Accordingly, it ispreferable to proceed with the hardening reaction at a reaction rateranging from 2% or more to 20% or less.

After heating, evacuation and centrifugal degassing are performed for apredetermined time, the motor 84 is stopped, the evacuation of thevacuum chamber 81 by the vacuum pumping system 85 is finished and theobjects to be degassed, 87 a and 87 b are taken out of the centrifugaldegassing apparatus 80.

Next, the plug 50 is replaced with a mouthpiece member 60 shown in FIG.1 (c).

The mouthpiece member 60 is a tapered tube, wherein the size of anaperture 63 of a bigger diameter at the opposite side to the taperedpart is almost the same size as the outer diameter of the protrusion 41,and preferably, a screw thread is provided on the internal surface ofthe aperture 63 to mount the mouthpiece member 60 to the top of theprotrusion 41.

Numeral 18 in FIGS. 3 (a) and (b) shows an adhesion apparatus comprisinga semi-hardened adhesive 38, the adhesive container 30 accommodating theadhesive 38, the mouthpiece member 60 mounted to the adhesive container30, and a lid member 70 covering the aperture 33 of the container body31.

The adhesive 38 has been subjected to heating, evacuation andcentrifugal degassing while being contained in the adhesive container 30and is semi-hardened.

A pipe 71 is connected to the lid member 70 at one end thereof, and to agas cylinder not shown in the FIGS. 3(a) and 3(b) at the other end.

A clearance 39 is formed between the lid member 70 and the liquidsurface of the semi-hardened adhesive 38 and, when a certain amount ofgas is sent from the gas cylinder, the gas is designed to be supplied tothe clearance 39 through the pipe 71.

A pore 64, which is the discharging outlet of a small diameter, isdisposed at the tip of the tapered part 62 of the mouthpiece member 60.

The gas supplied to the clearance 39 presses the liquid surface of thesemi-hardened adhesive 38 and the same volume of the adhesive 38 as thatof the gas supplied is discharged from the pore 64.

Numeral 27 in FIG. 5 (a) is a working table for coating, on which a basefilm 13 composed of a resin is disposed. A wiring film composed of apatterned copper foil is extended on the surface of the base film 13.Numeral 22 in FIG. 5 (a) is a part of the wiring film, which serves as aconnecting part to which a chip is electrically connected as describedlater.

Above the connecting part 22, the adhesive container 30 in the stateshown in FIGS. 3 (a), (b) is disposed, whose pore 64 of the mouthpiecemember 60 is oriented to the surface of the base film 13.

Next, a certain amount of gas is supplied to the container body 31 and acertain amount of the semi-hardened adhesive 38 is then discharged fromthe pore 64.

Numerical 12 in FIG. 5 (b) shows a semi-hardened adhesive discharged.The connecting part 22 is extended on the base film 13, and the surfaceof the base film 13 and that of the connecting part 22 are partiallycovered with the adhesive 12 discharged.

Numeral 15 in FIG. 6 (a) shows a substrate where a certain amount of theadhesive 12 is coated on the base film 13.

The substrate 15 is moved from the working table for coating 27 to aworking table for mounting 28 disposed near the working table forcoating 27.

Next (as shown in FIGS. 6 a-6 c), a chip 11 retained by a pressing jig29 is rested above the connecting part 22 of the substrate 15,positioning is performed between the connecting part 21 of the chip 11and the connecting part 22 of the substrate 15, the pressing jig 29 ismoved downward, and the chip 11 is dabbed at the surface of the adhesive12. When the chip 11 is pressed by the pressing jig 29, the chip 11pushes the adhesive 12 away to allow the connecting parts 21, 22 tocontact with each other. Although an integrated circuit or individualsemiconductor chip constituted of a silicon crystal, GaAs crystal or thelike is normally used for the chip 11, a silicon chip for a conductiontest is used here.

A heater is disposed inside the pressing jig 29 to preheat the chip 11at a temperature at which the hardening reaction of the adhesive 12 isprogressed and, consequently, the adhesive 12 is heated by the chip 11.

The working table for coating 28 is heated at a predeterminedtemperature so that it does not cool the adhesive 12.

The reaction of resin components in the adhesive 12 proceeds throughheat supplied from the chip 11 and, when connecting parts 21, 22 ascontacted with each other are hardened up to 100% or near 100%, the chip11 is mounted on the substrate 15 by the hardened adhesive 12.

In this case, since the hardening reaction has proceeded in the adhesive12 before temperature up by the chip 11 to make the same besemi-hardened, a time period until the complete hardening of theadhesive 12 can be shortened by an extent corresponding to the hardeningreaction beforehand.

After the complete hardening of the adhesive 12 to allow the chip 11 tobe mounted on the base film 13, the pressing jig 29 is removed from thechip 11, the substrate 15 mounted with the chip 11 is moved to asubsequent process and the substrate 15 just after coated with theadhesive 12 is moved from the working table for coating 27 to theworking table for mounting 28 and mounting of the chip 11 is continued.

As mentioned above, according to the invention the adhesive 12 is notheated on the working table for coating 27, therefore even if a troubleoccurs in the mounting process of the chip 11 or other processes and thesubstrate 15 is left as it stands on the working table for coating 27,no defect occurs in the substrate since the hardening reaction of theadhesive 12 does not proceed.

EXAMPLES

Adhesives 38 of Examples 1 to 8 and Comparative Examples 1 to 8 wereprepared by changing kinds of resins and heating conditions duringvacuum degassing, the chip 11 was affixed with the adhesive 12discharged on the base film 13, and then mounting conditions wereevaluated. In the following Table 1, kinds of resins, heating conditionsand results of evaluation are indicated. TABLE 1 Heating conditionEvaluation results A B C D E F G Remarks Resin 1 Comparative Room 600 0◯ X ◯ X Generation of voids Example 1 temperature Example 1 60 180 1.9 ◯◯ ◯ ◯ Example 2 60 1800 21.5 ◯ ◯ ◯ ◯ Comparative 60 2100 23.5 X — — —Dispensing unable Example 2 Example 3 40 600 1.9 ◯ ◯ ◯ ◯ Example 4 100120 15 ◯ ◯ ◯ ◯ Comparative 100 50 5.2 ◯ X ◯ X Insufficient degassing,Example 3 generation of voids Comparative 110 50 20.2 ◯ X ◯ XInsufficient degassing, Example 4 generation of voids Resin 2Comparative Room 600 0 ◯ X ◯ X Generation of voids Example 5 temperatureExample 5 60 100 2.2 ◯ ◯ ◯ ◯ Example 6 60 900 20.4 ◯ ◯ ◯ ◯ Comparative60 1200 24.5 X — — — Dispensing unable Example 6 Example 7 40 300 2.1 ◯◯ ◯ ◯ Example 8 100 60 16.2 ◯ ◯ ◯ ◯ Comparative 100 50 7.3 ◯ X ◯ XInsufficient degassing, Example 7 generation of voids Comparative 110 4519.6 ◯ X ◯ X Insufficient degassing, Example 8 generation of voids(Note)For Comparative Examples 1 and 5, a vacuum centrifugal degassing wasperformed at a room temperature (25 ± 2° C.) for 900 seconds.A: Hearting temperature (° C.)B: Heating time (second)C: Measurement result of reaction rate (%)D: Evaluation result of dispensabilityE: Evaluation result of appearanceF: Evaluation result of initial conductivityG: Evaluation result of conductivity after aging(1) Resin

The components of “Resin 1” in Table 1 areHP4032:EP828:HX3748:A187:RY200=40:20:40:3:5.

The components of “Resin 2” areHP4032:EP630:HX3921:A187:RY200=30:30:40:3:5.

HP4032: Epoxy resin made by Dainippon Ink And Chemicals, Incorporated.

EP828, EP630: Epoxy resins made by Japan Epoxy Resins Co., Ltd.

HX3748, HX3921: Curing agents made by Asahi Kasei Corporation

A187: Coupling agent made by Nihonunica Corporation

PY200: Filler made by Nippon Aerosil Co., Ltd.

All of the above are commercially available under the names given fromthe companies disclosed.

(2) Conditions of Evacuation, Heating and Centrifugal Degassing

Pressure in the vacuum chamber 81: 5 mTorr or less

Distance between rotation center and the adhesive 37 under degassing:about 30 cm

Rotational speed: 1,000 to 1,800 rpm Temperature of the adhesive 37under rotation: Heating condition A in Table 1

Heating time: Heating condition B in Table 1

(3) Substrate 15

Base film 13: Polyimide film of 20 μm thick.

Wiring film: Copper foil of 12 μm thick.

Connecting part 22: Ni/Au plated layer is formed on the wiring film.

(4) Chip 11

Dimensions: 6.3×6.3×0.4 mm

Connecting part 21: Copper bump of diameter 60 μm and height 20 μm andAu plated layer is formed on the surface.

(5) Mounting Conditions

Temperature of the pressing jig 29 and pressing period: 200° C./10seconds for Resin 1 and 230° C./5 seconds for Resin 2.

Temperature of the working table for mounting 28: 80° C.

Pressing pressure: 60 g/bump

(6) Content of Evaluation

1) C: Measurement Results of Reaction Rate (%)

The reaction rate R is found by the following formula from the calorificvalue Q₁ of DSC (differential scanning calorimetry) before evacuation,heating and centrifugal degassing are performed and the calorific valueQ₂ of DSC after evacuation, heating and centrifugal degassing wereperformed.R={(1−Q ₂)/Q ₁}×1002) D: Evaluation Results of Dispensability

An adhesive that could be discharged was determined ◯ and an adhesivethat could not be discharged was determined X when the adhesivecontainer 30 of 10 cm³ and the pore 64 of diameter 1 mm were used.

3) E: Evaluation Results of Appearance

An adhesive without no void (no bubble) was determined ◯ and an adhesivewith void (bubble) was determined X when the adhesive 12 discharged onthe base film 13 was visually observed before mounting the chip 11.

4) F: Evaluation Results of Initial Conductivity

Resistance value was measured between the connecting parts 21 and 22with the four-terminal method. An adhesive with the maximum resistancevalue of 100 mΩ or less was determined ◯ and an adhesive with themaximum resistance value exceeding 100 mΩ was determined X.

5) G: Evaluation Results of Conductivity After Aging

An adhesive mounted with the chip 11 was left in an atmosphere at 85° C.and 85% RH for 1,000 hours, and then the same evaluation as the initialconductivity evaluation was conducted.

(7) Conclusion

The chip mounting methods according to the present invention (Examples 1to 8) did not generate voids.

The evaluation results of Comparative Examples 1 to 8 show that thedispensability was poor when a reaction rate was too high and voids weregenerated when the same was too low.

The conditions of heating, evacuation and centrifugal degassing arepreferable when the heating temperature is 40° C. or more and 100° C. orless and the reaction rate is 2% or more and 20% or less, judging fromthe differences in the heating conditions and the reaction rates ofExamples 1 to 8 and Comparative Examples 1 to 8. It is desirable thatthe time is 60 seconds or longer.

OTHER EXAMPLES

As examples other than Examples and Comparative Examples described inTable 1, Resin 1 and Resin 2 filled in the adhesive container 30respectively were subjected to processing of evacuation and centrifugaldegassing at room temperature for 900 seconds, then were left in avacuum oven controlled at 60° C. for 600 seconds, and were heated anddegassed in a vacuum atmosphere. The reaction rates of Resin 1 and Resin2 were 10.2% and 15.6%, respectively. These adhesives showed preferableresults in all of the evaluation items D to G.

OTHER COMPARATIVE EXAMPLES

As Comparative Examples, each of Resin 1 and Resin 2 was left in avacuum oven controlled at 60° C. for 600 seconds to be heated anddegassed in a vacuum atmosphere. After terminating the heating anddegassing, each of them was taken out of the vacuum oven and tried to befilled in the adhesive container 30. However, both could not be filledin the container because of increased viscosity, resulting from too muchproceeding of the reaction.

Advantageously, embodiments of the present invention provide adhesionfree from bubbles.

While the invention has been described with respect to a limited numberof embodiments, those skilled in the art, having benefit of thisdisclosure, will appreciate that other embodiments can be devised whichdo not depart from the scope of the invention as disclosed herein.Accordingly, the scope of the invention should be limited only by theattached claims.

1.-10. (canceled)
 11. An adhesion apparatus comprising an adhesive container connected to a pore and an adhesive disposed in said adhesive container and being constituted such that a desired amount of said adhesive can be discharged from said pore, wherein said adhesive is disposed in said adhesive container, and has been vacuum-degassed by an applied centrifugal force while being heated in the state placed in a vacuum atmosphere.
 12. The adhesion apparatus according to claim 11, wherein said adhesive is semi-hardened at a reaction rate ranging from 2% or more to 20% or less. 